THERMAL COMPOUND COOLER PASTE

Description

THERMAL COMPOUND COOLER PASTE

THERMAL COMPOUND COOLER PASTE

KEY SPECS

High stability and reliability
Apply to CPU, VGA, LED, Chipset, and PC components
Low thermal resistance, high conductivity for heat transfer
Compliance with RoHS REACH PFOS requirement
Net weight:35g
Package weight:45g
Color: Grey, White

Detailed Description

Generic Thermal Compound Thermal Paste Large Needle HY510 For CPU VGA LED Chipset.

• Will help your electrical appliances improve conductivity
•  and enhance heat dissipation with the heatsink and fan components.
• This will improve the cooling of your CPU as well as GPU processors
• Improves performance stability by regulating heat. Better conductivity means better cooling.